The model POU3300 Point-of-Use Thermoelectric Temperature Control System provides uniform and repeatable temperature control for plasma etch applications. The POU3300 system offers dynamic temperature control of the process chamber cathode / electrode / anode and can be synchronized with any etch process.

The accuracy of the POU 3300 allows for independent control of the process fluid temperature to the wafer chuck within +/- 0.1 °C of set point, and the fast response time of the system allows for maximum wafer-to-wafer repeatability throughout the etch process.

With the POU3300, you can achieve unprecedented results in etch performance, chamber uptime, reduced cost of ownership and fab space utilization – all while improving your process reliability.